• Abrasive products are specialized for glass industry
Grinding wheels and saw blade



  • backing grinding wheel of wafers

    Usage:To be used for semi-conducts grinding and preeision processing.



  • diamond saw blade
     
     
     

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    Feature:
    1.High cutting efficiency,artistic,saving material,no jumping edge and easy to control.
    2.The general cutting thickness is 20-35mm,and the max cutting thickness:40mm
    3.Short manufacturing cycle.



All products above can be customized!
Download details of abrasive products for glass industry
Add:No.10 Dongqing Street,High&New tech Development Zone. Zhengzhou, Henan, China.