• Abrasive products are specialized for glass industry
Grinding wheels and saw blade
backing grinding wheel of wafers
Usage:To be used for semi-conducts grinding and preeision processing.
diamond saw blade
Feature:
1.High cutting efficiency,artistic,saving material,no jumping edge and easy to control.
2.The general cutting thickness is 20-35mm,and the max cutting thickness:40mm
3.Short manufacturing cycle.